Process Development Engineer (R&D) - WireBond

Process Development Engineer (R&D, NPI) with wire bond process experience based in Selangor, up to 10k

Your new company
Your new company is a well-known MNC based in Selangor, providing semiconductor product packaging and test services. They are expanding their team for developing own wire bond process.

Your new role
As a Process Development Engineer, you will be an expert to establish and setup new assembly process, equipment, tooling capabilities for any new package or devices, also input knowledge for process optimization and secure High-Volume Manufacturing.

What you'll need to succeed
To be successful in this role you must be:
- Min 5 years working experiences as process or equipment engineer in semiconductor industry.
- Strong technical skill in Wire Bond or more of the following semiconductor manufacturing processes (Screen Print, Die Attach, Clip Bond, Reflow, and Plasma) is advantageous.
- Experienced with KNS & ASM wire bonders.
- Good knowledge at development of Power packages (PQFN, TOLL, LFPAK etc.) an added advantage.

What you'll get in return
In return for your dedication and hard work, you’ll be rewarded with:
- Competitive compensation package including a competitive performance-based bonus structure and consistent career development
- Able to work in a strong technical team, also in a promising MNC company with career advancement and personal growth await in the future.

What you need to do now
If you're interested in this role, click 'apply now' to forward an up-to-date copy of your CV, or call us now.
If this job isn't quite right for you but you are looking for a new position, please contact us for a confidential discussion on your career. #1232969


Job Type

Talk to a consultant

Talk to WenKai Goh, the specialist consultant managing this position, located in Sunway
Corporate Suite 19-01 at Sunway Resort Hotel,, Persiaran Lagoon,

Telephone: +60376118613